PCB design & layout
Schematic capture, multi-layer layout, controlled impedance and DFM, signed off against the manufacturer before a single board is cut.

Hardware Product Development · Slovakia
Electronics, firmware and mechanics engineered as one product, from the first block diagram to a factory-ready package.
Schematic capture, multi-layer layout, controlled impedance and DFM, signed off against the manufacturer before a single board is cut.
Bring-up, drivers and embedded firmware written against the real silicon. Bootloaders, OTA and the timing the datasheet only hints at.
Mechanical CAD and enclosure design that fits the board, the connectors and the hand that holds it, modelled for the process that will mould it.
Gerbers, BOM, assembly drawings and a tested first article. A manufacturing package a factory can build from without calling you twice.
Concept to manufacture
The same workflow whether it is a sensor, a controller or a connected consumer device: decide the architecture, build real hardware, prove it, then hand it to the factory.
We start at the block diagram: power budget, compute, sensing, connectivity and cost. The architecture is decided before the schematic, so the board is right the first time.
First boards and a printed enclosure in hand fast. Real hardware to probe, flash and stress, not a render to admire.
Bench testing, signal integrity, thermals and field trials. We find the failure mode before your customers do.
DFM, a clean manufacturing package and a tested first article. The factory gets something it can build at volume.
Electronics, firmware and mechanical engineering under one roof, so the board, the code and the enclosure are designed for each other, not stitched together at the end.
Schematic capture and multi-layer PCB layout: power integrity, controlled impedance, EMC and a board laid out for the assembly line, not just the simulator.
Embedded firmware on bare metal or RTOS: drivers, bootloaders, OTA updates and the real-time behaviour the product actually depends on.
Mechanical CAD and enclosure design tuned to the board, the connectors, the thermals and the manufacturing process that will produce it.
Rapid prototypes and structured validation: bring-up, test rigs, environmental and reliability testing before anything is committed to scale.
Gerbers, BOM, assembly drawings, test procedures and a supplier-ready package. A clean handoff to manufacturing, with us still on the line.
Representative hardware engagements. Descriptions below illustrate the kind of work, not audited client figures.
A connected sensor product taken from block diagram to a manufacturable board, firmware and enclosure as one coordinated build instead of three disconnected vendors.
Concept to tested first article in a single engagement
A ruggedised controller engineered for an industrial environment: EMC-aware layout, validated thermals and firmware hardened for the field.
Validated against its real operating envelope before production
A complete manufacturing package, from Gerbers and BOM to assembly drawings and test procedures, handed to a contract manufacturer ready to build.
A factory-ready package, not a pile of source files
Tell us what you are building. A human reads every brief, usually within one business day. Need the software and platform around the hardware? See our web & software development work.
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